Thin Film Control/Analysis

Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.

Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.Interference occurs when monochromatic light hits the sample surface, resulting in...

Emission analysis type end-point monitor intended for end-point detection or plasma condition control in the plasma-based semiconductor thin-film process.

Produits : UVISEL VIS : 210-880 nm | UVISEL FUV : 190-880 nm | UVISEL NIR : 245-2100 nm | UVISEL ER : 190-2100 nm |

Idéal pour la caractérisation des couches minces en recherche et développement.